Samsung Develops First 16GB Multi-Chip Package

Samsung Electronics announced Wednesday that it had developed the world’s first 16-chip MCP (multi-chip package) technology by stacking 16 memory chips in one package. The new 16-chip MCP is created by staking 16 8Gb (gigabit) NAND flash chips, which has the highest density among products currently being produced, and allows up to a 16 gigabyte (GB) MCP solution, said the company. And the firm added that 16 stack is 30 percent smaller than a 10-chip MCP developed last year. Since the first development of technology with 6-chip MCP in 2003, the company has followed up with 8-chip MCPs in 2004, 10 in 2005, and this year 16-chip varieties, leading the MCP industry four straight years.

As mobile digital devices centered on cell phones are getting smaller and smaller while at the same time being equipped with an increasing array of features, the demand for MCP, which enables stacking several kinds of memory chips in a package, is growing. As the sole firm to possess the memory total solution technology that composes the MCP, Samsung Electronics topped the world MCP market for the first time in 2004, and is expected to maintain the top spot this year for the third straight year with market share of 35 percent. “With Samsung holding technology that is around two years ahead of the competition, who are mired in staking 8 chips, we anticipate the company’s leadership in the next generation package technology field will become even more pronounced,” the company said.

(englishnews@chosun.com )