Korea has averted another delay in its epically drawn-out attempt to acquire four airborne early warning system or AWACS planes by concluding tough final price negotiations with Boeing for the U.S. firm’s E-737 aircraft. The Defense Acquisition Program Agency announced the decision after a Defense Acquisition Committee meeting on the so-called E-X Project chaired by Defense Minister Yoon Kwang-ung on Wednesday. DAPA said it will sign a contract with the U.S. aerospace giant late this month to buy the four planes for some US$1.59 billion, one in 2011 and three in 2012.
A Defense Ministry official said the spy planes are essential for Korea’s independent combat operations after the country takes over wartime operational control of Korean troops from the U.S. Israel’s IAI Elta had been the sole other remaining bidder in the latest round but was dropped because it failed to win export permission for some key parts from the U.S. government by the deadline, DAPA said.
The airborne early warning aircraft E-737/ courtesy of Boeing
The Boeing aircraft has a radar to monitor the entire Korean Peninsula and the skies of neighboring countries within a 360-km radius. It can detect enemy planes flying up to 700 km away. It can track air and sea targets simultaneously with Northrop Grumman's Multi-Role Electronically Scanned Array (MESA) radar and has a device distinguishing between friend and foe. Its introduction here is expected to hugely enhance the Korean military’s independent intelligence and command capabilities.
The aircraft has six multi-purpose “mission consoles” with ultra-high resolution flat-panel tactical displays, and accommodates two pilots and six to 10 crew. It can fly at a speed of up to Mach 0.78 and at an operational ceiling of 12,400 m. Its flying range is 6,482 km. In regional comparison, Japan has 17 AWACS craft -- four E-767s and 13 E-2Cs -- and China is also developing several kinds of spy planes. A DAPA official said Korea won a more advantageous deal than Australia and Turkey, which purchased the same model in 2000 and 2001 for inflation-adjustable prices, while Korea will buy the aircraft at a fixed price with other benefits like technology transfer. Boeing initially asked for US$1.9 billion.
(englishnews@chosun.com )
Thursday, November 09, 2006
Thursday, November 02, 2006
Samsung Develops First 16GB Multi-Chip Package
Samsung Electronics announced Wednesday that it had developed the world’s first 16-chip MCP (multi-chip package) technology by stacking 16 memory chips in one package. The new 16-chip MCP is created by staking 16 8Gb (gigabit) NAND flash chips, which has the highest density among products currently being produced, and allows up to a 16 gigabyte (GB) MCP solution, said the company. And the firm added that 16 stack is 30 percent smaller than a 10-chip MCP developed last year. Since the first development of technology with 6-chip MCP in 2003, the company has followed up with 8-chip MCPs in 2004, 10 in 2005, and this year 16-chip varieties, leading the MCP industry four straight years.
As mobile digital devices centered on cell phones are getting smaller and smaller while at the same time being equipped with an increasing array of features, the demand for MCP, which enables stacking several kinds of memory chips in a package, is growing. As the sole firm to possess the memory total solution technology that composes the MCP, Samsung Electronics topped the world MCP market for the first time in 2004, and is expected to maintain the top spot this year for the third straight year with market share of 35 percent. “With Samsung holding technology that is around two years ahead of the competition, who are mired in staking 8 chips, we anticipate the company’s leadership in the next generation package technology field will become even more pronounced,” the company said.
(englishnews@chosun.com )
As mobile digital devices centered on cell phones are getting smaller and smaller while at the same time being equipped with an increasing array of features, the demand for MCP, which enables stacking several kinds of memory chips in a package, is growing. As the sole firm to possess the memory total solution technology that composes the MCP, Samsung Electronics topped the world MCP market for the first time in 2004, and is expected to maintain the top spot this year for the third straight year with market share of 35 percent. “With Samsung holding technology that is around two years ahead of the competition, who are mired in staking 8 chips, we anticipate the company’s leadership in the next generation package technology field will become even more pronounced,” the company said.
(englishnews@chosun.com )
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